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| a FEATURES 44 V Supply Maximum Ratings VSS to V DD Analog Signal Range Low On Resistance (100 max) Low Power (ISUPPLY < 75 A) Fast Switching Break-Before-Make Switching Action Plug-in Replacement for DG408/DG409 APPLICATIONS Audio and Video Routing Automatic Test Equipment Data Acquisition Systems Battery Powered Systems Sample and Hold Systems Communication Systems LC2MOS 4-/8-Channel High Performance Analog Multiplexers ADG408/ADG409 FUNCTIONAL BLOCK DIAGRAMS ADG408 S1 S1A DA S4A D S1B DB S8 1 OF 8 DECODER S4B 1 OF 4 DECODER ADG409 A0 A1 A2 EN A0 A1 EN GENERAL DESCRIPTION PRODUCT HIGHLIGHTS The ADG408 and ADG409 are monolithic CMOS analog multiplexers comprising eight single channels and four differential channels respectively. The ADG408 switches one of eight inputs to a common output as determined by the 3-bit binary address lines A0, A1 and A2. The ADG409 switches one of four differential inputs to a common differential output as determined by the 2-bit binary address lines A0 and A1. An EN input on both devices is used to enable or disable the device. When disabled, all channels are switched OFF. The ADG408/ADG409 are designed on an enhanced LC2MOS process which provides low power dissipation yet gives high switching speed and low on resistance. Each channel conducts equally well in both directions when ON and has an input signal range that extends to the supplies. In the OFF condition, signal levels up to the supplies are blocked. All channels exhibit breakbefore-make switching action, preventing momentary shorting when switching channels. Inherent in the design is low charge injection for minimum transients when switching the digital inputs. The ADG408/ADG409 are improved replacements for the DG408/DG409 Analog Multiplexers. 1. Extended Signal Range The ADG408/ADG409 are fabricated on an enhanced LC2MOS process giving an increased signal range that extends to the supply rails. 2. Low Power Dissipation 3 Low RON 4. Single Supply Operation For applications where the analog signal is unipolar, the ADG408/ADG409 can be operated from a single rail power supply. The parts are fully specified with a single +12 V power supply and will remain functional with single supplies as low as +5 V. REV. A Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 World Wide Web Site: http://www.analog.com Fax: 781/326-8703 (c) Analog Devices, Inc., 1998 ADG408/ADG409-SPECIFICATIONS DUAL SUPPLY1 Parameter ANALOG SWITCH Analog Signal Range RON RON LEAKAGE CURRENTS Source OFF Leakage IS (OFF) Drain OFF Leakage ID (OFF) ADG408 ADG409 Channel ON Leakage ID, IS (ON) ADG408 ADG409 DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current IINL or IINH CIN, Digital Input Capacitance DYNAMIC CHARACTERISTICS2 tTRANSITION tOPEN tON (EN) tOFF (EN) Charge Injection OFF Isolation Channel-to-Channel Crosstalk CS (OFF) CD (OFF) ADG408 ADG409 CD, CS (ON) ADG408 ADG409 POWER REQUIREMENTS IDD ISS IDD 100 200 20 -75 85 11 40 20 54 34 1 5 1 5 500 100 200 10 85 150 (VDD = +15 V, VSS = -15 V, GND = 0 V, unless otherwise noted) B Version -40 C to +25 C +85 C VSS to VDD 40 100 15 0.5 1 1 1 1 125 40 100 15 0.5 1 1 1 1 T Version -55 C to +25 C +125 C Units Test Conditions/Comments VSS to VDD V typ 125 max max 50 100 50 100 50 2.4 0.8 10 nA max nA max nA max nA max nA max V min V max A max pF typ ns typ ns max ns min ns typ ns max ns typ ns max pC typ dB typ dB typ pF typ pF typ pF typ VD = 10 V, IS = -10 mA VD = +10 V, -10 V VD = 10 V, VS = Test Circuit 2 VD = 10 V; VS = Test Circuit 3 VS = VD = 10 V; Test Circuit 4 10 V; 10 V; 50 100 50 100 50 2.4 0.8 10 8 120 250 10 125 225 65 150 8 120 250 10 85 150 20 -75 85 11 40 20 54 34 1 5 1 5 500 10 125 225 65 150 VIN = 0 or VDD f = 1 MHz RL = 300 , CL = 35 pF; VS1 = 10 V, VSS = 10 V; Test Circuit 5 RL = 300 , CL = 35 pF; VS = +5 V; Test Circuit 6 RL = 300 , CL = 35 pF; VS = +5 V; Test Circuit 7 RL = 300 , CL = 35 pF; VS = +5 V; Test Circuit 7 VS = 0 V, RS = 0 , CL = 10 nF; Test Circuit 8 RL = 1 k, f = 100 kHz; VEN = 0 V; Test Circuit 9 RL = 1 k, f = 100 kHz; Test Circuit 10 f = 1 MHz f = 1 MHz f = 1 MHz pF typ pF typ A typ A max A typ A max A typ A max VIN = 0 V, VEN = 0 V VIN = 0 V, VEN = 2.4 V NOTES 1 Temperature ranges are as follows: B Version: -40C to +85C; T Version: -55C to +125C. 2 Guaranteed by design, not subject to production test. Specifications subject to change without notice. -2- REV. A ADG408/ADG409 SINGLE SUPPLY1 Parameter ANALOG SWITCH Analog Signal Range RON LEAKAGE CURRENTS Source OFF Leakage IS (OFF) Drain OFF Leakage ID (OFF) ADG408 ADG409 Channel ON Leakage ID, IS (ON) ADG408 ADG409 DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current IINL or IINH CIN, Digital Input Capacitance DYNAMIC CHARACTERISTICS2 tTRANSITION tOPEN tON (EN) tOFF (EN) Charge Injection OFF Isolation Channel-to-Channel Crosstalk CS (OFF) CD (OFF) ADG408 ADG409 CD, CS (ON) ADG408 ADG409 POWER REQUIREMENTS IDD IDD 100 200 (VDD = +12 V, VSS = 0 V, GND = 0 V, unless otherwise noted) B Version -40 C to +25 C +85 C 0 to VDD 90 0.5 1 1 1 1 50 100 50 100 50 2.4 0.8 10 8 130 10 140 60 5 -75 85 11 40 20 54 34 1 5 500 100 200 8 130 10 140 60 5 -75 85 11 40 20 54 34 1 5 500 90 0.5 1 1 1 1 50 100 50 100 50 2.4 0.8 10 T Version -55 C to +25 C +125 C 0 to VDD Units V typ nA max nA max nA max nA max nA max V min V max A max pF typ ns typ ns typ ns typ ns typ pC typ dB typ dB typ pF typ pF typ pF typ Test Conditions/Comments VD = +3 V, +10 V, IS = -1 mA VD =8 V/0 V, VS = 0 V/8 V; Test Circuit 2 VD =8 V/0 V, VS = 0 V/8 V; Test Circuit 3 VS = VD = 8 V/0 V; Test Circuit 4 VIN = 0 or VDD f = 1 MHz RL = 300 , CL = 35 pF; VS1 = 8 V/0 V, VS8 = 0 V/8 V; Test Circuit 5 RL = 300 , CL = 35 pF; VS = +5 V; Test Circuit 6 RL = 300 , CL = 35 pF; VS = +5 V; Test Circuit 7 RL = 300 , CL = 35 pF; VS = +5 V; Test Circuit 7 VS = 0 V, RS = 0 , CL = 10 nF; Test Circuit 8 RL = 1 k, f = 100 kHz; VEN = 0 V; Test Circuit 9 RL = 1 k, f = 100 kHz; Test Circuit 10 f = 1 MHz f = 1 MHz f = 1 MHz pF typ pF typ A typ A max A typ A max VIN = 0 V, VEN = 0 V VIN = 0 V, VEN = 2.4 V NOTES 1 Temperature ranges are as follows: B Version: -40C to +85C; T Version: -55C to +125C. 2 Guaranteed by design, not subject to production test. Specifications subject to change without notice. REV. A -3- ADG408/ADG409 ABSOLUTE MAXIMUM RATINGS 1 (TA = +25C unless otherwise noted) ORDERING INFORMATION VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+44 V VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to +25 V VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to -25 V Analog, Digital Inputs2 . . . . . VSS -2 V to VDD +2 V or 20 mA, Whichever Occurs First Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 20 mA Peak Current, S or D (Pulsed at 1 ms, 10% Duty Cycle max) . . . . . . . . . . . 40 mA Operating Temperature Range Industrial (B Version) . . . . . . . . . . . . . . . . . -40C to +85C Extended (T Version) . . . . . . . . . . . . . . . . -55C to +125C Storage Temperature Range . . . . . . . . . . . . -65C to +150C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150C Cerdip Package, Power Dissipation . . . . . . . . . . . . . . . 900 mW JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 76C/W Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +300C Plastic Package, Power Dissipation . . . . . . . . . . . . . . . 470 mW JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 117C/W Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260C TSSOP Package, Power Dissipation . . . . . . . . . . . . . . 450 mW JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 155C/W JC, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 50C/W SOIC Package, Power Dissipation . . . . . . . . . . . . . . . . 600 mW JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 77C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220C NOTES 1 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time. 2 Overvoltages at A, EN, S or D will be clamped by internal diodes. Current should be limited to the maximum ratings given. Model1 ADG408BN ADG408BR ADG408BRU ADG408TQ ADG409BN ADG409BR ADG409TQ Temperature Range -40C to +85C -40C to +85C -40C to +85C -55C to +125C -40C to +85C -40C to +85C -55C to +125C Package Option2 N-16 R-16A RU-16 Q-16 N-16 R-16A Q-16 NOTES 1 To order MIL-STD-883, Class B processed parts, add /883B to T grade part numbers. 2 N = Plastic DIP; Q = Cerdip; R = 0.15" Small Outline IC (SOIC); RU = Think Shrink Small Outline Package (TSSOP). CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADG408/ADG409 feature proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE -4- REV. A ADG408/ADG409 PIN CONFIGURATIONS (DIP/SOIC/TSSOP) TERMINOLOGY VDD A0 1 EN 2 VSS 3 S1 4 16 15 14 Most positive power supply potential. Most negative power supply potential in dual supplies. In single supply applications, it may be connected to ground. Ground (0 V) reference. Ohmic resistance between D and S. Difference between the RON of any two channels. Source leakage current when the switch is off. Drain leakage current when the switch is off. Channel leakage current when the switch is on. Analog voltage on terminals D, S. Channel input capacitance for "OFF" condition. Channel output capacitance for "OFF" condition. "ON" switch capacitance. Digital input capacitance. Delay time between the 50% and 90% points of the digital input and switch "ON" condition. Delay time between the 50% and 90% points of the digital input and switch "OFF" condition. Delay time between the 50% and 90% points of the digital inputs and the switch "ON" condition when switching from one address state to another. "OFF" time measured between the 80% point of both switches when switching from one address state to another. Maximum input voltage for Logic "0." Minimum input voltage for Logic "1." Input current of the digital input. A measure of unwanted signal which is coupled through from one channel to another as a result of parasitic capacitance. A measure of unwanted signal coupling through an "OFF" channel. A measure of the glitch impulse transferred from the digital input to the analog output during switching. Positive supply current. Negative supply current. A1 A2 GND VDD A0 1 EN 2 VSS 3 S1A 4 16 15 14 A1 GND VDD S1B VSS ADG408 13 ADG409 13 TOP VIEW S2 5 (Not to Scale) 12 S5 S3 S4 6 7 11 10 9 TOP VIEW S2A 5 (Not to Scale) 12 S2B S3A S4A 6 7 11 10 9 GND RON RON IS (OFF) S6 S7 S8 S3B S4B DB D8 DA 8 ADG408 Truth Table ID (OFF) ON SWITCH NONE 1 2 3 4 5 6 7 8 ID, IS (ON) VD (VS) CS (OFF) CD (OFF) CD, CS (ON) CIN tON (EN) tOFF (EN) A2 X 0 0 0 0 1 1 1 1 A1 X 0 0 1 1 0 0 1 1 A0 X 0 1 0 1 0 1 0 1 EN 0 1 1 1 1 1 1 1 1 ADG409 Truth Table Al X 0 0 1 1 A0 X 0 1 0 1 EN 0 1 1 1 1 ON SWITCH PAIR NONE 1 2 3 4 tTRANSITION tOPEN VINL VINH IINL (IINH) Crosstalk Off Isolation Charge Injection IDD ISS REV. A -5- ADG408/ADG409 Typical Performance Characteristics 120 TA = +25 C 100 VDD = +5V VSS = -5V 180 TA = +25 C 160 140 VDD = +5V VSS = 0V 80 RON - VDD = +10V VSS = -10V 60 RON - VDD = +12V VSS = -12V 120 100 VDD = +10V VSS = 0V VDD = +12V VSS = 0V 80 40 VDD = +15V VSS = -15V 20 -15 -10 -5 0 5 VD (VS) - Volts 10 15 60 40 VDD = +15V VSS = 0V 0 3 6 9 VD (VS) - Volts 12 15 Figure 1. RON as a Function of VD (VS): Dual Supply Voltage Figure 4. RON as a Function of VD (VS): Single Supply Voltage 100 90 80 130 VDD = +15V VSS = -15V 120 VDD = +12V VSS = 0V 110 100 70 RON - RON - +125 C +85 C +125 C 60 50 90 +85 C 80 +25 C 40 30 -15 70 +25 C 60 -10 -5 0 5 VD (VS) - Volts 10 15 0 2 4 6 8 VD (VS) - Volts 10 12 Figure 2. RON as a Function of VD (VS) for Different Temperatures Figure 5. RON as a Function of VD (VS) for Different Temperatures 0.2 TA = +25 C VDD = +15V VSS = -15V LEAKAGE CURRENT - nA 0.04 TA = +25 C VDD = +12V VSS = 0V 0.02 IS (OFF) LEAKAGE CURRENT - nA 0.1 ID (ON) 0 ID (OFF) IS (OFF) -0.02 0 ID (OFF) ID (ON) -0.1 -0.04 -0.2 -15 -10 -5 0 VD (VS) - Volts 5 10 15 -0.06 0 2 4 6 VD (VS) - Volts 8 10 12 Figure 3. Leakage Currents as a Function of VD (VS) Figure 6. Leakage Currents as a Function of VD (VS) -6- REV. A ADG408/ADG409 120 VDD = +15V VSS = -15V 100 tTRANSITION 120 tON (EN) 140 VDD = +12V VSS = 0V tTRANSITION 80 100 tON (EN) t - ns 60 t - ns 80 tOFF (EN) 60 40 tOFF (EN) 20 1 3 5 7 9 VIN - Volts 11 13 15 40 1 3 5 7 VIN - Volts 9 11 13 Figure 7. Switching Time vs. VIN (Bipolar Supply) Figure 10. Switching Time vs. VIN (Single Supply) 400 VIN = +5V 300 VIN = +5V 300 tTRANSITION t - ns tON (EN) 200 200 t - ns tTRANSITION 100 100 tOFF (EN) tON (EN) tOFF (EN) 0 0 5 7 9 11 VSUPPLY - Volts 13 15 5 7 9 11 VSUPPLY - Volts 13 15 Figure 8. Switching Time vs. Single Supply Figure 11. Switching Time vs. Bipolar Supply 104 VDD = +15V VSS = -15V 104 VDD = +15V VSS = -15V 103 IDD - A 103 ISS - A 102 EN = 2.4V 101 EN = 0V EN = 2.4V EN = 0V 102 10 100 1k 10k 100k FREQUENCY - Hz 1M 10M 100 10-1 10 100 1k 10k 100k FREQUENCY - Hz 1M 10M Figure 9. Positive Supply Current vs. Switching Frequency Figure 12. Negative Supply Current vs. Switching Frequency REV. A -7- ADG408/ADG409 110 VDD = +15V VSS = -15V 100 100 110 VDD = +15V VSS = -15V OFF ISOLATION - dB CROSSTALK - dB 90 90 80 80 70 70 1k 10k 100k FREQUENCY - Hz 1M 60 1k 10k 100k FREQUENCY - Hz 1M Figure 13. Off Isolation vs. Frequency Figure 14. Crosstalk vs. Frequency Test Circuits I DS VDD VSS V1 S1 S2 VDD VSS D EN +0.8V VD ID (OFF) A S VS RON = V1/I DS D VS S8 GND Test Circuit 1. On Resistance Test Circuit 3. ID (OFF) VDD VSS VDD VSS S1 IS (OFF) A S2 S8 VS VD VDD VSS VDD S1 D VSS D ID (ON) A VD S8 GND EN +0.8V VS GND EN 2.4V Test Circuit 2. IS (OFF) Test Circuit 4. ID (ON) -8- REV. A ADG408/ADG409 VDD 3V ENABLE DRIVE (VIN) 0V 50% 50% tr < 20ns tf < 20ns A0 S1 VIN tTRANSITION tTRANSITION 90% OUTPUT 2.4V EN GND 90% *SIMILAR CONNECTION FOR ADG409 300 35pF 50 A1 S2 THRU S7 A2 S8 VS8 OUTPUT D VS1 VSS VDD VSS ADG408* Test Circuit 5. Switching Time of Multiplexer, tTRANSlTlON VDD 3V ADDRESS DRIVE (VIN) 0V VIN 50 A0 VSS VDD VSS S1 VS A1 S2 THRU S7 A2 S8 80% OUTPUT 80% 2.4V EN ADG408* D GND OUTPUT 300 35pF tOPEN *SIMILAR CONNECTION FOR ADG409 Test Circuit 6. Break-Before-Make Delay, tOPEN VDD 3V ENABLE DRIVE (VIN) 0V 50% 50% A0 VSS VDD VSS S1 VS A1 A2 tON (EN) 0.9VO OUTPUT VIN 50 tOFF (EN) 0.9VO EN GND S2 THRU S8 ADG408* D OUTPUT 300 35pF *SIMILAR CONNECTION FOR ADG409 Test Circuit 7. Enable Delay, tON (EN), tOFF (EN) REV. A -9- ADG408/ADG409 VDD VSS 3V A0 VIN A1 A2 VDD VSS ADG408* VOUT QINJ = CL VOUT VOUT VS RS S EN GND VIN D VOUT CL 10nF *SIMILAR CONNECTION FOR ADG409 Test Circuit 8. Charge Injection VDD VSS VDD VSS VDD A0 A1 A2 VSS A0 VDD VSS EN 2.4V ADG408 D VOUT 1k 1k GND A1 A2 S1 ADG408 D 1k VOUT S1 S8 VS 0V EN S2 S8 VS GND OFF ISOLATION = 20 LOG VOUT/VIN CROSSTALK = 20 LOG VOUT/VIN Test Circuit 9. OFF Isolation Test Circuit 10. Channel-to-Channel Crosstalk -10- REV. A ADG408/ADG409 OUTLINE DIMENSIONS Dimensions shown in inches and (mm). Plastic DIP (N-16) 0.87 (22.1) MAX 16 1 9 8 SO (Narrow Body) (R-16A) 0.3937 (10.00) 0.3859 (9.80) 0.25 0.31 (6.35) (7.87) 0.1574 (4.00) 0.1497 (3.80) 16 1 9 8 0.2440 (6.20) 0.2284 (5.80) PIN 1 0.035 (0.89) 0.125 (3.18) MIN 0.018 (0.46) 0.100 (2.54) BSC 0.033 (0.84) 0.18 (4.57) SEATING PLANE 0.011 (0.28) 0.3 (7.62) SEATING PLANE 0.0500 (1.27) BSC 0.0192 (0.49) 0.0138 (0.35) 0.0099 (0.25) 0.0075 (0.19) 0.18 (4.57) MAX PIN 1 0.0098 (0.25) 0.0040 (0.10) 0.0688 (1.75) 0.0532 (1.35) 0.0196 (0.50) x 45 0.0099 (0.25) 8 0 0.0500 (1.27) 0.0160 (0.41) Cerdip (Q-16) 0.005 (0.13) MIN 16 Thin Shrink Small Outline Package (TSSOP) (RU-16) 0.201 (5.10) 0.193 (4.90) 0.080 (2.03) MAX 9 0.310 (7.87) 0.220 (5.59) 0.177 (4.50) 0.169 (4.30) 1 8 16 9 PIN 1 0.840 (21.34) MAX 0.200 (5.08) MAX 0.200 (5.08) 0.125 (3.18) 0.022 (0.558) 0.014 (0.356) 0.060 (1.52) 0.015 (0.38) 0.320 (8.13) 0.290 (7.37) 0.100 (2.54) BSC 0.150 (3.81) MIN SEATING 0.070 (1.78) PLANE 0.030 (0.76) 1 8 15 0 0.015 (0.38) 0.008 (0.20) PIN 1 0.006 (0.15) 0.002 (0.05) 0.0433 (1.10) MAX 0.0256 (0.65) BSC 0.0118 (0.30) 0.0075 (0.19) 0.0079 (0.20) 0.0035 (0.090) 0.256 (6.50) 0.246 (6.25) SEATING PLANE 8 0 0.028 (0.70) 0.020 (0.50) REV. A -11- PRINTED IN U.S.A. C1824a-0-4/98 |
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